Insert Molding Injection Plastic
Metal Stampings Encapsulation Tooling QS 9000 ISO 9002 In-Mold Circuit Pre-mold Over-mold Perfing |
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Insert Injection Molding | |||||||||||||
Insert Molding replaces metal and plastic assemblies, and components made
solely of plastic or metal. This unique manufacturing process combines metal
and plastic, ceramics, or multiple combinations of materials, components and
plastic into a single unit. The process uses engineering plastics for improved
wear resistance, tensile strength and weight reduction and uses metallic materials
for strength and conductivity. The result is a single heterogeneous composite that
always provides superior functional performance to any other manufacturing
alternative for products requiring high current applications. |
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In-Mold Circuit Definition | |||||||||||||
"In-Mold Circuit Definition" is a derivative of insert
injection molding. Shown below are four techniques under this classification.
Each technique has a certain advantage over the other: |
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Two Shot Metal / Plastic Molding | |||||||||||||
This technology uses a two shot process. However, the pre-molded part
utilizes Metal Injection Molding (MIM) technology and can be of any 3 D
form. The advantage here is that any circuit thickness can be offered so
there is no current capacity limitations. There is usually no need for
plating as certain metals can be chosen which, after specialized treatment,
can meet customer functional requirements. Circuits can also be combined
with terminals to make a complete interconnect system without the necessity
of a separate connection. This technology also lends itself to a combination
of metal and plastic where the original was a close tolerance machined metal
product. |
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Two Shot Molding with Plating | |||||||||||||
This method uses a two shot injection molding technique, similar to that
used in insert injection molding, to form circuit patterns on complex,
irregularly shaped plastic molded parts. The first shot is usually a
non-plateable resin where the areas for the plateable resin are defined
in the part. The first shot is over-molded with plateable resin. The
exposed plateable resin defines the circuit traces. Following a chemical
process that enhances the resin's ability to accept plating, the part is
then plated with the desired materials and to the required thickness. This
technology is better suited for low current applications. |
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